Pepperl+Fuchs at FachPack 2006 in Nuremberg

At the FachPack trade fair, which is taking place from September 26-28 in Nuremberg, we will be presenting future-oriented solutions for the packaging technology. Come and be inspired by the solutions our experts can offer you to meet the special demands of your applications in Hall 2, Booth F106.

The main news this year is:

• IO-Link
  Point-to-point interface based on two-wire technology for communication and monitoring the sensor and actuator level
• Motion sensor MS32
  Based on e.g. a CCD chip, high-integrated on-chip-image processing is used to register two-dimensional movement at object level - similar to the optical computer mouse

These are just a few of the highlights awaiting you at the booth of Pepperl+Fuchs at Fachpack 2006. We look forward to meeting you in Hall 2 at Booth F106.