Serviceline Industrial Sensors
Serviceline Explosion Protection

Compact Fieldbus Power Hub Motherboard for Yokogawa ALF111 MBHC-FB-8R.YO*

  • 8 segments, redundant, individual modules per segment
  • Customized for Yokogawa, ALF 111
  • High-power trunk: Live work on devices in any hazardous area
  • Best quality, smallest size and lowest heat dissipation
  • For FOUNDATION Fieldbus H1
  • Optional advanced diagnostics
  • Passive impedance for high reliability
  • Supports Ex ic voltage limitation
  • Installation in Zone 2/Div. 2
  • Spring terminals or screw terminals selectable
  • Left/right version for optimized cabinet layout

Please note: All product-related documents, such as certificates, declarations of conformity, etc., which were issued prior to the conversion under the name Pepperl+Fuchs GmbH or Pepperl+Fuchs AG, also apply to Pepperl+Fuchs SE.

Download the complete datasheet as a PDF:

Datasheet excerpt: Technical data of  MBHC-FB-8R.YO*

General specifications
Design / MountingMotherboard based
Rated voltage19.2 ... 35 V SELV/PELV
Rated current16 A
Power dissipationtyp. 0.4 W per segment
Fieldbus connection
Number of segments8 redundant
Host-sideredundant Yokogawa ALF111 with AKB336 interface cables
Terminating resistor100 Ω integrated
Indicators/operating means
Fault signalVFC alarm 1 A, 50 V DC, normally closed
Galvanic isolation
Fieldbus segment/Fieldbus segmentfunctional insulation acc. to IEC 62103, rated insulation voltage 50 Veff
Fieldbus segment/Supplyfunctional insulation acc. to IEC 62103, rated insulation voltage 250 Veff
Directive conformity
Electromagnetic compatibility
Directive 2014/30/EUEN 61326-1:2013
Standard conformity
Electromagnetic compatibilityNE 21:2011
Degree of protectionIEC 60529
Fieldbus standardIEC 61158-2
Shock resistanceEN 60068-2-27
Vibration resistanceEN 60068-2-6
Ambient conditions
Ambient temperature-40 ... 70 °C (-40 ... 158 °F)
Storage temperature-40 ... 85 °C (-40 ... 185 °F)
Relative humidity< 95 % non-condensing
Shock resistance15 g 11 ms
Vibration resistance1 g , 10 ... 150 Hz
Pollution degreemax. 2, according to IEC 60664
Corrosion resistanceacc. to ISA-S71.04-1985, severity level G3
Mechanical specifications
Connection typeplug-in terminals , spring terminal and screw terminal
Core cross section2.5 mm2
Housing materialPolycarbonate
Housing width268 mm
Housing height150 mm
Housing depth69 mm
Degree of protectionIP20
Massapprox. 1350 g
MountingDIN mounting rail
Data for application in connection with hazardous areas
CertificateTÜV 10 ATEX 555761X
MarkingEx-Hexagon II 3G Ex ec IIC T4 Gc
Directive conformity
Directive 2014/34/EUEN 60079-0:2012 , EN 60079-11:2012 , EN 60079-7:2015
International approvals
FM approvalFM19US0015X FM19CA0011X
Approved forClass I, Division 2, Groups A, B, C, D, T4 / Class I, Zone 2, AEx/Ex ec IIC T4
IECEx approvalIECEx TUN 13.0037X
Approved forEx ec IIC T4 Gc
Certificates and approvals
Marine approvalDNV TAA 0000272 , pending for MBHC-FB-8R.YO.R
General information
Supplementary informationStatement of Conformity, Declaration of Conformity, Attestation of Conformity and instructions have to be observed where applicable. For information see


ECLASS 11.027242603
ECLASS 10.0.127242603
ECLASS 9.027242603
ECLASS 8.027242603
ECLASS 5.127242603
ETIM 8.0EC001598
ETIM 7.0EC001598
ETIM 6.0EC001598
ETIM 5.0EC001604
UNSPSC 12.139121008

Documents: MBHC-FB-8R.YO*

ManualsLanguageFile TypeFile Size
ManualENGPDF1882 KB
Instruction manuals
ИнструкцииBULPDF208 KB
Návod k poużitíCZEPDF202 KB
Instruktions manualDANPDF0 KB
Instruction manualENGPDF76 KB
KasutusjuhendESTPDF195 KB
KäyttöohjeFINPDF0 KB
Manuel d'instructionsFRAPDF141 KB
BetriebsanleitungGERPDF78 KB
Οδηγίες χρήσηςGREPDF0 KB
HandleidingHOLPDF199 KB
Instruction manual / BetriebsanleitungHRVPDF200 KB
Használati útmutatóHUNPDF201 KB
Manuale di istruzioniITAPDF138 KB
Lietošanas pamācībaLAVPDF200 KB
Instrukciju vadovasLITPDF202 KB
Instrukcja obsługiPOLPDF203 KB
Manual de instruçõesPORPDF202 KB
Manual de utilizareRONPDF202 KB
Návod na poużitieSLKPDF0 KB
Navodila za uporaboSLVPDF200 KB
Manual de instruccionesSPAPDF138 KB
ManualSWEPDF198 KB
Product information
Conformity matrix for R2-SP-IC* and F2-SP-IC* with motherboards: MBHC*, FBTA-228-BPFB-R-8R and power supply modules: HCD2-FBPS-*ENGPDF143 KB
Guideline for Using Fieldbus Equipment in Zone 2ENGPDF883 KB


CADFile TypeFile Size
CAD drawing / CAD-ZeichnungZIP3914 KB

Approvals+Certificates: MBHC-FB-8R.YO*

Statements of complianceCertificate No.File TypeFile Size
EU-Declaration of conformity / EU-KonformitätserklärungDOC-2261DPDF80 KB
Canada FMFM 19 CA 0011XPDF356 KB
DNV GL MarineTAA0000272PDF78 KB
EAC Lenpromexpertiza (LPE) EAC TP TC 012/2011EAEC RU C-DE.AA71.B.00037/19PDF2835 KB
Europe TUV Nord ATEX Category 3 GTÜV 10 ATEX 555761XPDF2296 KB
Russia Belarus Kazakhstan EAC EAC TP TC 020/2011 EMCEAEC N RU D-DE.EA11.B.00318PDF2892 KB
TUV Nord IECEx ec Certificate of ConformityIECEx TUN 13.0037XLINK---
Worldwide Fieldbus FoundationPS066300PDF31 KB
Worldwide Fieldbus FoundationPS066200PDF31 KB

Function: MBHC-FB-8R.YO*

The FieldConnex ® compact Power Hub is a modular fieldbus power supply for eight segments with lowest power dissipation and smallest foot print. It supports explosion protection e.g. the high-power trunk for longest cable run and highest device count. The Power Hub supports optional advanced diagnostics for fast fieldbus commissioning and online monitoring.

The motherboard is the wiring interface with connectors for direct DCS hook-up via the AKB 336 system cable. The version with type code extension ".R" has host connections on the right-hand side for symmetrical cabinet layout. Sockets for all modules enable simple installation and replacement without tools. For power redundancy with seamless transfer, pairs of modules feed each segment. Wire connections can be selected as spring terminals or screw terminals.

This design allows the most compact cabinet layout. Excellent availability and a very long service life are achieved through: passive impedance filter per segment, high-availability fieldbus termination and plugs with retaining screws. Electronics are optimized for lowest power dissipation and compactness.

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