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Explosion Protection

Fieldbus Power Hub, Compact Power Supply Module HCD2-FBPS-1.23.500

HCD2-FBPS-1.23.500
  • Output: 21 ... 23 V/500 mA
  • Voltage limitation for Entity ic and Ex nL
  • With galvanic isolation
  • Installation in Zone 2/Class I, Div. 2
  • For FOUNDATION Fieldbus H1 and PROFIBUS PA
  • Highest efficiency, lowest heat dissipation for highest packing density
  • Hot swappable in redundant configuration
  • Module exchange without tools during operation

Download the complete datasheet as a PDF:


Datasheet excerpt: Technical data of HCD2-FBPS-1.23.500

General specifications
Design / MountingMotherboard based
Supply
Rated voltage19.2 ... 35 V DC
Power dissipationtyp. 1.2 W
Fieldbus interface
Rated voltage21 ... 23 V
Rated current500 ... 10 mA
Short-circuit current550 mA
Terminating resistormotherboard specific
Indicators/operating means
LED ERRred flashing: short-circuit or undervoltage at output
LED PWRgreen if Uout > 21 V
Galvanic isolation
Fieldbus segment/Supplyfunctional insulation acc. to IEC 62103, rated insulation voltage 250 V AC
Directive conformity
Electromagnetic compatibility
Directive 2014/30/EUEN 61326-1:2013
Standard conformity
Electromagnetic compatibilityNE 21:2011
Degree of protectionIEC 60529
Fieldbus standardIEC 61158-2
Shock resistanceEN 60068-2-27
Vibration resistanceEN 60068-2-6
Ambient conditions
Ambient temperature-40 ... 70 °C (-40 ... 158 °F)
Storage temperature-40 ... 85 °C (-40 ... 185 °F)
Relative humidity< 95 % non-condensing
Shock resistance15 g 11 ms
Vibration resistance1 g , 10 ... 150 Hz
Pollution degreemax. 2, according to IEC 60664
Corrosion resistanceacc. to ISA-S71.04-1985, severity level G3
Mechanical specifications
Connection typemotherboard specific
Core cross-sectionmotherboard specific
Housing materialPolycarbonate
Housing width12.5 mm
Housing height106 mm
Housing depth128 mm
Degree of protectionIP20
Massapprox. 150 g
Mountingmotherboard mounting
Data for application in connection with hazardous areas
Outputs
Voltage24 V
CertificateTÜV 10 ATEX 555761X
MarkingEx-Hexagon II 3G Ex nA IIC T4 Gc
Directive conformity
Directive 2014/34/EUEN 60079-0:2012 , EN 60079-11:2012 , EN 60079-15:2010
International approvals
FM approvalCoC 3024816, CoC 3024816C
Approved forClass I, Division 2, Groups A, B, C, D, T4 / Class I, Zone 2, AEx/Ex nA IIC T4
IECEx approvalIECEx TUN 13.0037X
Approved forEx nA IIC T4 Gc
Certificates and approvals
Marine approvalDNV A-14038

Documents: HCD2-FBPS-1.23.500

Instruction manualsLanguageFile TypeFile Size
ИнструкцииBULPDF208 KB
Návod k poużitíCZEPDF202 KB
Instruktions manualDANPDF0 KB
Instruction manualENGPDF76 KB
KasutusjuhendESTPDF195 KB
KäyttöohjeFINPDF0 KB
Manuel d'instructionsFRAPDF141 KB
BetriebsanleitungGERPDF78 KB
Οδηγίες χρήσηςGREPDF0 KB
HandleidingHOLPDF199 KB
Instruction manual / BetriebsanleitungHRVPDF200 KB
Használati útmutatóHUNPDF201 KB
Manuale di istruzioniITAPDF138 KB
Lietošanas pamācībaLAVPDF200 KB
Instrukciju vadovasLITPDF202 KB
Instrukcja obsługiPOLPDF203 KB
Manual de instruçõesPORPDF202 KB
Manual de utilizareRONPDF202 KB
Návod na poużitieSLKPDF0 KB
Navodila za uporaboSLVPDF200 KB
Manual de instruccionesSPAPDF138 KB
ManualSWEPDF198 KB
Product information
Conformity matrix for R2-SP-IC* and F2-SP-IC* with motherboards: MBHC*, FBTA-228-BPFB-R-8R and power supply modules: HCD2-FBPS-*ENGPDF143 KB
Guideline for Using Fieldbus Equipment in Zone 2ENGPDF883 KB

Approvals+Certificates: HCD2-FBPS-1.23.500

Statements of complianceCertificate No.File TypeFile Size
EU-Declaration of conformity / EU-KonformitätserklärungDOC-2674APDF85 KB
Certificates
Canada FMFM 19 CA 0011XPDF316 KB
EAC Lenpromexpertiza (LPE) EAC TP TC 012/2011EAEC RU C-DE.AA71.B.00037/19PDF2835 KB
Europe TUV Nord ATEX Category 3 GTÜV 10 ATEX 555761XPDF2931 KB
India PESO (India) CCOEA/P/HQ/KA/104/5527 (P404204)PDF808 KB
Russia Belarus Kazakhstan EAC EMCEAEC N RU D-DE.EA11.B.00318PDF2892 KB
TUV NordIECEx TUN 13.0037XLINK---
USA FMFM 19 US 0015XPDF317 KB
Worldwide Fieldbus FoundationPS066200PDF31 KB

Associated Products: HCD2-FBPS-1.23.500

Matching system components

Output: 21 ... 23 V/500 mA, Voltage limitation for Entity ic and Ex nL, With galvanic isolation, Installation in Zone 2/Class I, Div. 2, For FOUNDATION Fieldbus H1 and PROFIBUS PApa
  • MBHC-FB-8R.HSC*
  • Compact Fieldbus Power Hub, Motherboard, Host System Connector
8 segments, redundant, individual modules per segment, Supports all PLC and PCS hosts, High-power trunk: Live work on devices in any hazardous area, Best quality, smallest size and lowest heat dissipation, For FOUNDATION Fieldbus H1pa
  • MBHC-FB-4.HSC*
  • Compact Fieldbus Power Hub, Motherboard, Host System Connector
4 segments, individual modules per segment, Customizable cable connections to any PLC and PCS hosts, High-power trunk: Live work on devices in any hazardous area, Best quality, smallest size and lowest heat dissipation, For FOUNDATION Fieldbus and PROFIBUS PApa
  • MBHC-FB-4R.HSC*
  • Compact Fieldbus Power Hub, Motherboard, Host System Connector
4 segments, redundant, individual modules per segment, Customizable cable connections to any PLC and PCS hosts, High-power trunk: Live work on devices in any hazardous area, Best quality, smallest size and lowest heat dissipation, For FOUNDATION Fieldbus and PROFIBUS PApa
Matching system components
  • MBHC-FB-4*
  • Compact Fieldbus Power Hub, Motherboard, Common Interface
4 segments, individual modules per segment, Supports all PLC and PCS hosts, High-power trunk: Live work on devices in any hazardous area, Best quality, smallest size and lowest heat dissipation, For FOUNDATION Fieldbus H1pa
  • MBHC-FB-4.GT*
  • Fieldbus Power Hub, Motherboard for Gateway and Power Supply Modules
4 segments, simplex, individual modules per segment, For PROFIBUS PA, For gateway and power supply modules, High-power trunk: Live work on devices in any hazardous area, Optional advanced diagnosticspa
  • MBHC-FB-4R*
  • Compact Fieldbus Power Hub Motherboard with Common Interface
4 segments, redundant, individual modules per segment, Supports all PLC and PCS hosts, High-power trunk: Live work on devices in any hazardous area, Best quality, smallest size and lowest heat dissipation, For FOUNDATION Fieldbus H1pa
  • MBHC-FB-4R.YO*
  • Compact Fieldbus Power Hub Motherboard for Yokogawa ALF111
4 segments, redundant, individual modules per segment, Customized for Yokogawa, ALF 111, High-power trunk: Live work on devices in any hazardous area, Best quality, smallest size and lowest heat dissipation, For FOUNDATION Fieldbus H1pa
  • MBHC-FB-4.YO*
  • Compact Fieldbus Power Hub, Motherboard for Yokogawa ALF111
4 segments, individual modules per segment, Customized for Yokogawa, ALF 111, High-power trunk: Live work on devices in any hazardous area, Best quality, smallest size and lowest heat dissipation, For FOUNDATION Fieldbus H1pa
  • MBHC-FB-8R*
  • Compact Fieldbus Power Hub, Motherboard, Common Interface
8 segments, redundant, individual modules per segment, Supports all PLC and PCS hosts, High-power trunk: Live work on devices in any hazardous area, Best quality, smallest size and lowest heat dissipation, For FOUNDATION Fieldbus H1pa
  • MBHC-FB-8R.RH*
  • Compact Fieldbus Power Hub, Motherboard, Redundant Host Terminals
8 segments, redundant, individual modules per segment, Supports all PLC and PCS hosts, redundant terminals, High-power trunk: Live work on devices in any hazardous area, Best quality, smallest size and lowest heat dissipation, For FOUNDATION Fieldbus H1 and PROFIBUS PApa
  • MBHC-FB-8R.YO*
  • Compact Fieldbus Power Hub, Motherboard for Yokogawa ALF111
8 segments, redundant, individual modules per segment, Customized for Yokogawa, ALF 111, High-power trunk: Live work on devices in any hazardous area, Best quality, smallest size and lowest heat dissipation, For FOUNDATION Fieldbus H1pa
General Notes Relating to Pepperl+Fuchs Product Information
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Pepperl+Fuchs is a leading developer and manufacturer of electronic sensors and components for the global automation market. Continuous innovation, enduring quality, and steady growth have been the foundation of our success for more than 70 years. Pepperl+Fuchs employs 6,200 people worldwide and has manufacturing facilities in Germany, USA, Singapore, Hungary, Indonesia and Vietnam, most of them ISO 9001 certified.