Electronics Industry

The ML100 sensors are made for the most complex applications in the electronics industry, from detection of heavily textured printed circuit boards (PCB) to the detection of irregularities, holes and slots.

The R2, R3, R2F, and R3F series miniature photoelectric sensors come in four housing designs and three sensing modes. The integrated DuraBeam laser technology is ideal for manufacturing processes that require reliable and precise detection of the smallest electronic components.

The GL5 sensor is available with seven mounting designs and features a high switching frequency. It enables detection at very high speed, i.e., for flipper control for PCB processing or inside pick and place machines where different components are handled at high speed.

The SU18 and SU19 series fiber optic sensors feature a slim housing design that seamlessly integrate into different processes, where they ensure precise positioning of PCB and/or lead frames.  

The R3F series miniature photoelectric sensors feature a compact size and a very small blind range, making them ideally suited for efficient detection of wafers in tight spaces.

Whether in automatic screen printing machines or for glass picking applications during final assembly—the F77 ultrasonic sensors with IO-Link interface precisely detect all types of surfaces without being affected by machine noise, or camera lighting.

The rugged and compact RFID control interfaces are used to control read/write operation of up to four different read/write heads, and to forward filtered raw data to higher-level systems.

During solar cell production, UDC ultrasonic sensors reliably detect correct infeed of wafers. Without being affected by their color or silicon brightness, they ensure that wafers are processed only one sheet at a time.